Kandou, a Lausanne, Switzerland-based a fabless semiconductor company that provides connectivity IP and chip solutions, raised $56m in funding.
The backers in the round, which brought the total funding raised to date to nearly $100m, included Bessemer Venture Partners, Columbia Lake Partners, Digital Transformation Fund, Fayerweather Capital Partners, Forestay Capital, Kreos Capital, Raging Capital, Swisscom Ventures, and Walden International.
The company intends to use the funds to scale all aspects of operations and to expand the development and deployment of its low power interconnect devices.
Founded in 2011 by Amin Shokrollahi, CEO, Kandou provides high-speed, energy efficient, chip-to-chip link solutions for the electronics industry through licensing and standard products that allow the devices we use every day to become smaller, more energy efficient and more cost effective.
Kandou has an IP portfolio that includes Chord‚Ñ¢ signaling, which has been adopted into industry specifications by JEDEC and the OIF.
The company will begin leveraging the innovations in its IP portfolio to launch a series of high speed, low power interconnect products for consumer and networking applications.